SK hynix hosts first Partners Day in Japan to strengthen chip supply chain

SK hynix brought together more than 20 Japanese semiconductor suppliers at its first Partners Day in Japan, seeking closer cooperation on advanced chip technologies and supply chain stability as artificial intelligence-driven memory demand surges.

The event, held Thursday in Chiba prefecture, brought together major Japanese materials suppliers Shin-Etsu, Sumco, JSR and Namics; equipment-makers Tokyo Electron and Screen Holdings; and chip processing and testing specialists Disco and Advantest.

While SK hynix has held annual supplier gatherings in Korea, this was its first in Japan, underscoring the growing importance of Japanese partners in its push to expand advanced memory production.

SK hynix Chief Production Officer Lee Byung-Ki attended alongside Vice President Kang Yu-jong, head of procurement, and Vice President Choi Woojin, head of packaging and testing.

The chipmaker shared its medium- to long-term business strategy and technology road map, giving suppliers an early look at future demand and development priorities to help them plan investments and secure production capacity.

Lee Hyunchul, vice president and head of procurement strategy, outlined the company's business outlook, while Lee Sunghoon, vice president and head of R&D process, presented its technology development plans.

"Korea and Japan have a complementary relationship," Lee Byung-Ki said, stressing that closer cooperation would strengthen technological competitiveness and support both countries' semiconductor industries.

Kang emphasized the need for tighter coordination with materials, components and equipment suppliers to tackle next-generation chipmaking challenges and ensure stable production.

Tokyo Electron Chief Operating Officer Hiroshi Ishida said early access to SK hynix's technology road map would help suppliers make investment and development decisions.

He pledged closer collaboration from the initial stages of technology development as AI makes memory chip manufacturing increasingly complex.